Canon
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The Canon Anelva I-1060 SV 2 + 1 is a physical vapor deposition (PVD) sputtering system. The Canon Anelva I-1060 SV 2 + 1 handles 8-inch wafers. The Canon Anelva I-1060 SV 2 + 1 was produced in 2003.[1]
PVD sputter systems are typically used to deposit metal layers, barrier films, and seed layers in semiconductor manufacturing. The process generally follows wafer cleaning and precedes later lithography or etching steps.
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The following facts about the Anelva I-1060 SV 2 + 1 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the Anelva I-1060 SV 2 + 1 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Anelva I-1060 SV 2 + 1 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Anelva I-1060 SV 2 + 1 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Anelva I-1060 SV 2 + 1 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Anelva I-1060 SV 2 + 1 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Sep 28, 2026.
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.