Besi
2009 SSI E
The Besi / Datacon 2009 SSI E is a die bonder used in semiconductor packaging. The 2009 SSI E includes a Single Wafer Loader and Magazine to Magazine material handling. The 2009 SSI E supports SoftSolder Wire Dispense with OMP1, OMP780, and OMP1230 options.[1][2][3][4]
What it is
How it works
General reference — not yet source-verifiedA die bonder places and attaches semiconductor dies onto a target substrate or package stage during assembly.
A packaging and bonding machine of this class commonly combines die handling, alignment, placement, and bonding functions in one platform.
Where it fits in the process flow
General reference — not yet source-verifiedThe Besi / Datacon 2009 SSI E belongs in back-end semiconductor assembly rather than wafer fabrication.
The machine sits between die preparation and package assembly steps, where individual dies are transferred, positioned, and bonded into a package flow.
Applications
What do the numbers mean?
Wafer handling4
Configuration & options17
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 2009 SSI E | — | 2014 | — | Equipment inventory listing[1] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 2009 SSI E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2009 SSI E are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2009 SSI E are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2009 SSI E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2009 SSI E is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2009 SSI E are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]inventory listing
- [3]inventory listing
- [4]Equipment inventory listing
Last updated Oct 3, 2026.
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