ASM
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASM MS 100 is a manual die attacher designed to attach die onto the surface of electrical components or printed circuit boards. The ASM MS 100 features a two-stage heating system and a die fillet dispenser for applying paste.[1]

The ASM MS 100 is a manual die attacher designed to attach die onto the surface of electrical components or printed circuit boards. The machine is equipped with a die fillet dispenser and a substrate holder.[1]
Die sorters typically consist of a wafer stage, a pickup head with vacuum, a placement stage, and a vision system for alignment. The machine picks die from the wafer and places them onto the target substrate.
The ASM MS 100 is used to attach die onto printed circuit boards or electrical components, placing them after the die have been separated from the wafer.[1]
The ASM MS 100 is designed to attach die onto printed circuit boards and electrical components.[1]
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| MS100Plus | — | 2014 | — | semistarcorp.com[4] |
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The ASM MS 100 is a manual die attacher designed to attach die onto the surface of electrical components or printed circuit boards.[1]
The ASM MS 100 features a safety cover over the open PCB, a lock to keep the cover closed during operation, and a fail-safe switch which stops the operation in the event of any malfunction.[1]
The ASM MS 100 is equipped with an intuitive LCD display and easy-to-use operator panel.[1]
The ASM MS 100 features a high-strength steel frame with rubber vibration damping mounts.[1]
The ASM MS 100 features a two-stage heating system, which ensures that the die attach has the correct temperature and avoids excess heat damage to the PCB surface.[1]
The following facts about the MS 100 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MS 100 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the MS 100 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MS 100 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MS 100 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MS 100 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Last updated Oct 2, 2026.
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.