ASM
AS 809
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedA die bonder typically uses a pick-and-place mechanism to retrieve a die from a wafer or tape and place it precisely onto a substrate.
The machine then applies a bonding medium, such as epoxy, solder, or eutectic alloy, and may include a curing or reflow step to complete the attachment.
Where it fits in the process flow
General reference — not yet source-verifiedDie bonding is a key step in the semiconductor assembly and packaging process, taking place after wafer dicing and before wire bonding or encapsulation.
Input to a die bonder is typically singulated die from a diced wafer mounted on a tape frame; output is a substrate or lead frame with die attached.
Applications
What do the numbers mean?
No specifications recorded yet
Be the first to add cited specifications for this tool.
Vintage & configurations
- 2000Production start[1]
Vintage 2000
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the AS 809 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the AS 809 are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented variants, configuration options, or revision breakpoints of the AS 809 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AS 809 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AS 809 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the AS 809 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]AS 809 — ASM | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Sep 27, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
