ASM
AB 339 Gold
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedThe ASM AB 339 Gold is a gold wire bonder used in semiconductor assembly and packaging.
How it works
General reference — not yet source-verifiedA wire bonder joins a semiconductor die to a package or substrate by making fine electrical interconnections with bonding wire.
Where it fits in the process flow
The AB 339 Eagle gold wire bonder was used for fine pad pitch ball grid array packages, QFP packages, and chip scale package quad flat no-lead assembly.[2]
Applications
The AB 339 Eagle gold wire bonder was applied to portable electronics packaging, including laptop computers, mobile phones, and PDAs.[2]
What do the numbers mean?
Configuration & options5
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kinds of bonding methods can this class use?General reference — not yet source-verified
Machines of this class may use heat, pressure, ultrasonic energy, adhesive processes, or other joining methods, depending on the package and materials.
What is the main goal of this equipment class?General reference — not yet source-verified
The main goal is to place and join small electronic parts accurately so the device can function as a packaged component.
Why is precision important in this class of machine?General reference — not yet source-verified
Precise alignment and controlled bonding are needed to achieve reliable mechanical attachment and consistent electrical connection in small-scale assemblies.
Not publicly documented
The following facts about the AB 339 Gold are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AB 339 Gold are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AB 339 Gold are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AB 339 Gold are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AB 339 Gold are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the AB 339 Gold is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]ASM Receives Wire Bonder Orders — asm.com (Nov 9, 2014)web.archive.org
Last updated Oct 3, 2026.
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