Waferpedia

Accretech

UF 3000 EX-e

Test & ProbeAccretech UF 3000 family
Research Quality: 40% complete
UF 3000 EX-e — Inventory photo
Fig. 01UF 3000 EX-eInventory photo[1]

What it is

General reference — not yet source-verified

Wafer probers are used in semiconductor manufacturing to electrically test individual die on a wafer before dicing. The machine positions the wafer relative to a probe card and makes temporary electrical contacts to measure device parameters.

How it works

General reference — not yet source-verified

The prober uses a movable chuck that holds the wafer and aligns it in X, Y, and theta under a microscope or camera system. The probe card, mounted above the chuck, contains fine needles that contact the wafer's bond pads. Once aligned, the chuck lifts the wafer to make contact, and the connected tester applies signals and measures responses. The machine then steps the wafer to the next die location automatically.

What do the numbers mean?

Power & electrical2

Single Phase[1]
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Power supply
Single Phase[1]
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Wafer handling2

Low noise hot chuck[1]
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Chuck type
Low noise hot chuck[1]
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Control & software3

Probe card interface
T 2000 ISS 64PARA 440mm Card[1]
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Tester interface
MHF 6000[1]
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Interface type
GPIB, Ethernet, Remote SS UI[1]
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Configuration & options11

Dual-temp DD 93K[4]
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T 2000 ISS 64PARA 440mm Card[1]
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MHF 6000[1]
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Cleaning unit 150 x 160mm[1]
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GPIB[1]
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Ethernet[1]
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Remote SS UI[1]
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FFU Option[1]
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Temperature capability
Dual-temp DD 93K[4]
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Cleaning unit size
150 x 160mm[1]
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FFU (Fan Filter Unit)[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationSingle Phase[1]
  • Power supplySingle Phase[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What types of measurements can be performed with machines of this class?General reference — not yet source-verified

Such systems can perform a wide range of electrical measurements including I-V curves, capacitance, gain, leakage current, and other parameters required for device characterization at the wafer level.

How is probe positioning accuracy achieved in this class of equipment?General reference — not yet source-verified

Accuracy is achieved through precision mechanics, optical alignment systems, and closed-loop feedback control to ensure reliable contact with device pads while minimizing drift.

What factors affect the throughput of a test and probe system?General reference — not yet source-verified

Throughput is influenced by wafer handling speed, probe approach and contact speed, the number of parallel test channels, and the complexity of test sequences.

Can these systems handle temperature-dependent testing?General reference — not yet source-verified

Yes, many machines of this class include an integrated temperature-controlled chuck that allows testing over a range of temperatures to assess device performance under different thermal conditions.

What are key considerations for integrating such a system into a production line?General reference — not yet source-verified

Key considerations include compatibility with existing wafer handling, alignment with test equipment, automation software, and support for various wafer sizes and device geometries.

Not publicly documented

The following facts about the UF 3000 EX-e are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UF 3000 EX-e are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the UF 3000 EX-e are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the UF 3000 EX-e are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the UF 3000 EX-e are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the UF 3000 EX-e is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Inventory photo
  4. [4]inventory listing
  5. [5]Equipment inventory listing
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Last updated Sep 30, 2026.

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