Accretech
UF 200
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Accretech UF 200 is an automatic wafer prober. The Accretech UF 200 supports 8-inch wafer sizes. The Accretech UF 200 is used for wafer testing and probing applications.[1][2]
What it is
How it works
General reference — not yet source-verifiedAn automatic wafer prober holds the wafer on a vacuum chuck and moves it to align each die with the probe card needles. The probe card is planar and contains many fine needles that contact all bond pads of a single die simultaneously. The system then steps to the next die and repeats the process.
Where it fits in the process flow
General reference — not yet source-verifiedWafer probers are used in semiconductor manufacturing after wafer fabrication and before final packaging. The prober tests each die on the wafer to identify functional devices, known-good-die, and parametric performance. Defective die are typically marked or mapped for rejection during the subsequent assembly process.
Applications
What do the numbers mean?
Wafer handling3
Configuration & options2
Parts & consumables
Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.
- Accretech / TSK 90 A / UF 200 XX BoardIn Productionsource[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the UF 200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UF 200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UF 200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UF 200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UF 200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UF 200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]Equipment inventory listing
- [3]Equipment inventory listing
- [4]Equipment inventory listing
- [5]UF 200 Automatic Wafer — Accretech | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 5, 2026.
