Waferpedia

Tool family

SUSS MicroTec XBC300 Gen2 D2W

The SUSS XBC300 Gen2 D2W is a permanent bonding system offered by SUSS MicroTec.

Models in this family

  1. The SUSS XBC300 Gen2 D2W is a permanent bonding system offered by SUSS MicroTec.

    Cited variants

    DesignationGenerationVintageChangesSource
    XBC300 Gen2 D2W/W2WGen2—SUSS lists this variant as a separate permanent bonding system, indicating support for both die-to-wafer and wafer-to-wafer bonding.suss.com[1]
    XBC300 Gen2 SPGen2—SUSS lists this as a distinct permanent bonding system.suss.com[1]

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]suss.comsuss.com