Tool family
Esec Esec 2100 sD advanced i
The Esec 2100 sD advanced i is a die bonder for epoxy die attach applications. The Esec 2100 sD advanced i is described as a 300 mm high speed platform with a wafer size range of 4" to 12" on 8" or 12" wafer frames.
Models in this family
- Esec 2100 sD advanced i3rd generation
The Esec 2100 sD advanced i is a die bonder for epoxy die attach applications. The Esec 2100 sD advanced i is described as a 300 mm high speed platform with a wafer size range of 4" to 12" on 8" or 12" wafer frames.
