Esec 2100 hS i

Models in this family

1. 

   2100 hS i3rd generation

   The Esec 2100 hS i is a die bonder for epoxy die attach applications. The Esec 2100 hS i is a 300 mm high-speed platform with support for wafer sizes from 4 inches to 12 inches on 8-inch or 12-inch wafer frames.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Esec 2100 hS	3rd generation	—	Base model in the same product family.	besi.com[1]
   Esec 2100 hS iXplus	—	—	Related product variant named on the product page.	besi.com[1]
   Esec 2100 sD advanced i	—	—	Related product variant named on the product page.	besi.com[1]
   Esec 2100 hS i	—	—	Related product variant named on the product page.	besi.com[1]
   Esec 2100 SC	—	—	Related product variant named on the product page.	besi.com[1]
   Esec 2100 SSI	—	—	Related product variant named on the product page.	besi.com[1]

Sources