The Disco DFG 840 is an automatic in-feed surface grinder for semiconductor wafer thinning, handling wafers from 4 to 8 inches.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|
| DFG841 | — | — | Complies with EC’s CE marking; based on SEMI S2-93 | s3-alliance.com[1] |