Comparison ledger
EV Group EVG40, Zygo Z3D-7000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EVG40EV Group | Z3D-7000Zygo |
|---|---|---|
| OEM | EV Group | Zygo |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | 5th generation |
| Family | EV Group EVG40 | Zygo Z3D-7000 |
| Cited variants | — | |
| Specifications | ||
| Measurement type | Top-to-bottom side alignment accuracy measurement system[1] | Non-contacting, non-destructive optical metrology[4] |
| Technology | Non-destructive, visible light, self calibrating technology[1] | ZYGO's fifth generation interferometric technology[4] |
| Measurement capability | Repeatable top-to-bottom side alignment accuracy measurement[1] | — |
| Supported wafer or substrate size | Any wafer or substrate material up to 200 mm[1] | — |
| Objective magnification | High power objectives from 5x to 50x[1] | — |
| Absolute accuracy | < 0.5 µm with a statistical probability of 99%[1] | — |
| Control platform | PC-based measurement system[1] | — |
| Automation range | Manual to fully-automated versions[1] | — |
| Standard basic unit | Alignment stage optics[1] | — |
| Advanced basic unit | Alignment stage optics; advanced features include image recognition system, quick transparent overlay, and linewidth measurement mode[1] | — |
| Semi-automated basic unit | Alignment stage optics; advanced features include image recognition system, quick transparent overlay, and linewidth measurement mode; automation features include programmable microscope stage rack and motorized chuck rotation[1] | — |
| Fully-automated basic unit | Alignment stage optics; advanced features include image recognition system, quick transparent overlay, and linewidth measurement mode; automation features include programmable microscope stage rack, motorized chuck rotation, and robotic autoload cassette-to-cassette[1] | — |
| Wafer size | Any wafer or substrate material up to 200 mm[1] | — |
| Measured parameters (NT variant) | Lithography-relevant parameters like critical dimensions, as well as bond alignment accuracy[2] | — |
| Measurement methods (NT variant) | Critical dimension (CD) measurement, die-to-die alignment verification, multi-layer thickness measurement[2] | — |
| Measurement accuracy (NT variant) | High measurement accuracy in vertical and lateral direction[2] | — |
| Overlay measurement (D2W variant) | 100 percent die overlay measurement with high precision[3] | — |
| Wafer sizes | — | 200 mm and 300 mm wafers[4] |
| Bridge-tool configuration | — | Can be configured to simultaneously handle both wafer sizes[4] |
| Key features | — | High speed non-contacting metrology; simultaneously measures multiple parameters; ISO Class 2, S2/S8, and CE certified; SEMI E95 compliant software; modular IntelliSensors reduce MTBR[4] |
| Software | — | MetroPro software[4] |
| Loaded wafers | — | FOUPS and/or open cassettes[4] |
| Throughput | — | Exceeds throughput of contact technologies (profilers, atomic force microscopes) by a factor of 10[4] |
| Simultaneous measurements | — | Film thickness, critical dimensions, overlay, trench depth, and general surface topography[4] |
| Precision | — | Sub-nanometer precision for critical etch depth processes[4] |
| Wafer loading | — | FOUPS and/or open cassettes, pre-alignment, super flat chuck[4] |
| Certifications | — | ISO Class 2, S2/S8, CE certified[4] |
| Software compliance | — | SEMI E95 compliant[4] |
| Modular sensors | — | IntelliSensors reduce MTBR[4] |
| Algorithms | — | OneShot, TopSlice, FilmSlice[4] |
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