Comparison ledger
Disco 3220, Disco DFL 7560 L, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | DFL 7560 LDisco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | Robot Wafer handling |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Disco DFL |
| Cited variants | — |
|
| Specifications | ||
| equipment type | dicing saw[2] | — |
| Workplace size | ø150 mm[3] | — |
| Spindle layout | Single[3] | — |
| Spindle output | 1.5 kW at 30,000 min-1[3] | — |
| Spindle max revolution speed | 40,000 min-1[3] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[3] | — |
| Y-axis index step | 0.0001 mm[3] | — |
| Z-axis repeating accuracy | 0.001 mm[3] | — |
| Z-axis max blade size | ø58 mm[3] | — |
| Wafer size | — | Robot Wafer handling[1] |
| Wafer | — | Can be modified at later date to 3”, 4” & 6” wafers and frame[1] |
| Configuration | — | Operation by touch panel LCD monitor[1] |
| Uninterruptible Power Supply | — | 1[1] |
| Wafer Sizes (standard) | — | 2, 3, 4 inch[1] |
| Wafer Size Modification | — | Can be modified to 3”, 4” & 6” wafers and frame[1] |
| Maximum Workpiece Size | — | ø150 mm[4] |
| Processing Mode | — | Fully automatic[4] |
| Dimensions (W x D x H) | — | 2,000 x 1,810 x 1,800 mm[4] |
| Weight | — | approx. 3,300 kg[4] |
| Robot Wafer Handling | — | Yes[1] |
| Operation Interface | — | Touch panel LCD monitor[1] |
| Power Supply | — | Step-down Transformer 400 V, 3 phases, 50 Hz[1] |
| CE Marking | — | Yes[1] |
| Microscope | — | Low and High Magnification microscope with LED illumination[1] |
| Axis Control | — | X and Y axis with linear scale closed loop control[1] |
| Laser Cooling | — | Laser power supply with built in water cooled chillers[1] |
| Additional Chiller | — | Chiller unit to supply cooling water for Laser power supply[1] |
| X Axis Chiller | — | Chiller unit to supply cooling water to X axis[1] |
| Z Axis Positional Repeatability | — | 0.002 mm[1] |
| Optional Upgrade | — | 200 mm Fully Automatic wafer handling from/to standard wafer cassette, Chuck for 200mm wafers, New robot design for handling heavier wafers, 6 inch Lens and new Galvo Scanner[1] |
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