Comparison ledger
Disco 3220, Disco 841 Back, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | 841 BackDisco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Disco 841 Back |
| Specifications | ||
| equipment type | dicing saw[1] | — |
| Workplace size | ø150 mm[2] | — |
| Spindle layout | Single[2] | — |
| Spindle output | 1.5 kW at 30,000 min-1[2] | — |
| Spindle max revolution speed | 40,000 min-1[2] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[2] | — |
| Y-axis index step | 0.0001 mm[2] | — |
| Z-axis repeating accuracy | 0.001 mm[2] | — |
| Z-axis max blade size | ø58 mm[2] | — |
| Wafer size range | — | 4 to 8 inches (100-200 mm)[3] |
| Grinding type | — | In-feed grinding with wafer rotation[3] |
| Number of spindles | — | 2[3] |
| Spindle speed range | — | 1000-7000 rpm[3] |
| Vertical stroke | — | 110 mm[3] |
| Chuck table type | — | Porous chuck table with vacuum chuck[3] |
| Grinding wheel diameter | — | 8 inches[3] |
| Cassette capacity | — | Two cassettes for loading/unloading[3] |
| Planarity accuracy (within wafer) | — | 0.0015 mm[3] |
| Compliance | — | EC CE marking and SEMI S2-93 (DFG841)[3] |
| Dimensions (W x D x H) | — | 1050 mm x 2150 mm x 1710 mm[3] |
| Electrical requirements | — | 200V, 3 Phase, 50/60 Hz[3] |
| CDA pressure | — | 0.5-0.8 MPa[3] |
| DI water pressure and flow | — | 0.2-0.3 MPa, 15 l/min or higher[3] |
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