Comparison ledger
Disco 3220, Disco 840, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | 840Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Disco 840 |
| Cited variants | — |
|
| Specifications | ||
| equipment type | dicing saw[2] | — |
| Workplace size | ø150 mm[3] | — |
| Spindle layout | Single[3] | — |
| Spindle output | 1.5 kW at 30,000 min-1[3] | — |
| Spindle max revolution speed | 40,000 min-1[3] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[3] | — |
| Y-axis index step | 0.0001 mm[3] | — |
| Z-axis repeating accuracy | 0.001 mm[3] | — |
| Z-axis max blade size | ø58 mm[3] | — |
| Wafer size range | — | 4–8 inch[1] |
| Spindle speed | — | 1000–7000 rpm[1] |
| Vertical stroke | — | 110 mm[1] |
| Planarity accuracy within wafer | — | 0.0015 mm[1] |
| Chuck table type | — | Porous vacuum chuck[1] |
| Grinding wheel diameter | — | 8 inch[1] |
| Number of cassettes | — | 2[1] |
| Number of spindles | — | 2 (independently adjustable)[1] |
| Dimensions (W × D × H) | — | 1050 × 2150 × 1710 mm[1] |
| Electrical supply | — | 200 V, 3 phase, 50/60 Hz[1] |
| CDA supply | — | 0.5–0.8 MPa[1] |
| DI water supply | — | 0.2–0.3 MPa, 15 l/min or higher[1] |
| Oil mist filtration system (optional) | — | Pure Boyd PBH 100[4] |
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