Comparison ledger
Accretech UF 3000 EX, Electroglas EG 4090 Automatic Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UF 3000 EXAccretech | EG 4090 Automatic WaferElectroglas |
|---|---|---|
| OEM | Accretech | Electroglas |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2026 Still in service |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech UF 3000 | Electroglas EG 4090 |
| Cited variants | — | |
| Specifications | ||
| Configuration | Auto-tilt Option[1] | Nickel Chuck[2] |
| HF | MHF 9000 EX[1] | — |
| Aard Holder | Nobinite[1] | — |
| Card Exchange | APC[1] | — |
| Temp | 50℃~150℃[1] | — |
| Cleaning Unit | 250 x 155 (notched)[1] | — |
| Tester I/F | GPIB[1] | — |
| CPU | Advme 7509[1] | — |
| Wafer Size | 12 inch[6] | — |
| Auto-tilt Option | Included[1] | — |
| Tri-Temp | Included[1] | — |
| Chuck Temperature Range | 50℃~150℃[1] | — |
| Compatible Tester Models | IP 750 EX-HD[1] | — |
| Card Holder Material | Nobinite[1] | — |
| Tester Interface | GPIB[1] | — |
| Prober Type | Prober[1] | — |
| Wafer Sizes | 12 inch[6] | — |
| Auto-tilt option | Yes[1] | — |
| No Chiller | Yes[1] | — |
| Vintage | 2007[1] | — |
| Airblower | — | IH[2] |
| Armsize | — | IH Bernoulli[2] |
| Wafer Size Support | — | 150 mm and 200 mm wafers[8] |
| Chuck Type | — | Nickel or Gold, hot chuck[2] |
| Alignment Accuracy | — | Micron-level[8] |
| Input Voltage | — | 115VAC[9] |
| Vision Module | — | PRM-3[9] |
| Display Control Module | — | DCM II or DCM-2[9] |
| Material Handler Module | — | Station CONT (ESC) or MHCM[9] |
| Prober Control Module | — | Yes[9] |
| Cassette Loader | — | Yes[9] |
| Probing Modes | — | Manual, semi-automatic, and fully automatic[8] |
| Temperature Control | — | Hot chuck with temperature control (TC2000)[10] |
| Thinwafer Support | — | Yes (listed as option)[2] |
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