Comparison ledger
Electroglas 1034, Teradyne Nextest Magnum 2 EV, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1034Electroglas | Nextest Magnum 2 EVTeradyne |
|---|---|---|
| OEM | Electroglas | Teradyne |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Electroglas 1034 | Teradyne Nextest Magnum 2 EV |
| Specifications | ||
| Tester Channels (per site assembly) | — | 128 tester channels[1] |
| Maximum Channels (with 40 site assembly boards) | — | Up to 5120 channels[1] |
| Channels (in listed configuration) | — | 1024 channels[2] |
| Digital test pins per site | — | 128[2] |
| Digital test pins per site assembly | — | 512 DTP per site assembly[2] |
| Device Power Supply (DPS) per site assembly | — | Up to 128 DPS per site assembly[2] |
| High voltage pins per site assembly | — | Up to 128 high voltage pins per site assembly[2] |
| Parametric measurement units per site | — | 8 parametric measurement unit per site[2] |
| Vector Performance - Algorithmic Pattern Generator (APG) | — | Offers a full Algorithmic Pattern Generator (APG) with Topo Scrambling and Logic Vector Memory (LVM) configurations per pin[1] |
| Hardware Acceleration | — | Built with a Dual Bank Error Catch Ram (ECR) system paired with an automated RA processor[1] |
| Per-Pin Architecture | — | Features fully independent data-per-pin architectures[1] |
| Software UI | — | Typically runs native Nextest Windows-based diagnostic software utilities (such as Ui.exe environments)[1] |
| Wafer size capability | — | 300mm[2] |
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