Disco
DFD 6341 alternatives
Comparable Dicing & Grinding equipment documented in the Waferpedia catalog.
6 comparable tools
Veeco
ADS 800 Dicing
Dicing & Grinding
The Veeco ADS 800 Dicing System is a dicing system configured with a 220 VAC, 3-phase, 50/60 Hz, 30 Amp power requirement and includes motion, control, vision, and coolant delivery components.
Accretech
SS 20 Automatic Dicing
Dicing & Grinding
Accretech SS20 is a semi-automatic dicing machine designed for wafer separation, supporting wafers up to 250 mm and square wafers.
Lapmaster
15
Dicing & Grinding
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
Blanchard
18 D Surface
Dicing & Grinding
The Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
Blanchard
20 36 Surface
Dicing & Grinding
The Blanchard 20 36 Surface is a surface grinder used in dicing and grinding applications.
Blanchard
22 AD 42
Dicing & Grinding
Compare interactively
Need a side-by-side spec table? Open the compare tool to pick any two models.
Compare DFD 6341 with another model →