Waferpedia

Comparison ledger

3220versusMWS 612

Disco 3220, Takatori MWS 612, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
MWS 612Takatori
OEMDiscoTakatori
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220Takatori MWS 612
Cited variants—
  • MWS 612 DD Multi[1]
Specifications
equipment typedicing saw[2]—
Workplace sizeø150 mm[3]—
Spindle layoutSingle[3]—
Spindle output1.5 kW at 30,000 min-1[3]—
Spindle max revolution speed40,000 min-1[3]—
X-axis feed speed range0.1 – 500 mm/s[3]—
Y-axis index step0.0001 mm[3]—
Z-axis repeating accuracy0.001 mm[3]—
Z-axis max blade sizeø58 mm[3]—
Maximum workpiece shape—φ150mm x 300mm[4]
Equipment type—Wire saw[4]
Category—Dicing & Grinding[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com