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Comparison ledger

3220versusDFD 6750 Fully Automatic Dicing

Disco 3220, Disco DFD 6750 Fully Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220Disco DFD 6750 Fully Automatic Dicing
Specifications
equipment typedicing saw[1]—
Workplace sizeø150 mm[2]—
Spindle layoutSingle[2]—
Spindle output1.5 kW at 30,000 min-1[2]—
Spindle max revolution speed40,000 min-1[2]—
X-axis feed speed range0.1 – 500 mm/s[2]—
Y-axis index step0.0001 mm[2]—
Z-axis repeating accuracy0.001 mm[2]—
Z-axis max blade sizeø58 mm[2]—
Max rotation diameter—340 mm[3]
Max jig size—300 x 160 mm (Applicable work size 280 × 140)[3]
X-axis Cutting range—300 mm[3]
Cutting speed—0.1 ~ 1,000 mm/s[3]
Y1・Y2 axis Cutting range—300 mm[3]
Index step—0.0001 mm[3]
Positioning accuracy—Within 0.003/660 (Single error), Within 0.002/5[3]
Z-axis Max stroke—19.2 mm (for Φ2 inch blade) / 19.9 mm (for Φ3 inch blade)[3]
Moving resolution—0.00005 mm[3]
Repeatability accuracy—0.001 mm[3]
θ-axis Max rotating angle—215 deg[3]
Spindle rated torque (1.8 kW)—0.29 N·m[3]
Spindle rated torque (2.2 kW)—0.7 N·m[3]
Rotation speed range (1.8 kW)—6,000 - 60,000 min⁻¹[3]
Rotation speed range (2.2 kW)—3,000 - 30,000 min⁻¹[3]
Equipment dimensions (W×D×H)—1,510 × 1,554 × 1,800 mm (excluding scrap box)[3]
Equipment weight—Approx. 2,200 kg[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]disco.co.jpdisco.co.jp