Comparison ledger
CEE 100, SUSS MicroTec MA 150 E Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100CEE | MA 150 E MaskSUSS MicroTec |
|---|---|---|
| OEM | CEE | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | 6" | Wafer Thickness Measurement |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 100 | SUSS MicroTec MA 150 |
| Cited variants |
| — |
| Specifications | ||
| Tool type | Spray Developer[1] | — |
| Accepts wafer size | up to 6" wafers[2] | — |
| Programmable programs | 10 programs[2] | — |
| Steps per program | up to 10 steps[2] | — |
| Programmable step parameters | Acceleration, Speed, Time[2] | — |
| Associated document | CEE Model 100CB Spinner.doc[2] | — |
| Wafer size | Up to 6 inches[2] | Wafer Thickness Measurement[3] |
| Programs | 10 programs each with up to 10 steps[2] | — |
| Control parameters | Acceleration, Speed, Time[2] | — |
| Configuration | — | Gen 2[3] |
| Prealigner Type | — | XRS[4] |
| Operating System | — | Windows 2000[4] |
| Lamphouse | — | 1000 Watt Lamphouse[4] |
| Exposure Optics | — | UV400 Optics (365nm/405nm exposure)[4] |
| Power Supply | — | CIC1200[4] |
| Microscope | — | DVM6 Microscope[4] |
| Single Objective | — | Configured to fit customer requirement (5x, 10x, or 20x)[4] |
| Vacuum Chuck | — | Configured to fit customer requirements[4] |
| Maskholder | — | Configured to fit customer requirements[4] |
| OEM | — | SUSS[3] |
| Model | — | MA 150 E[3] |
| Equipment type | — | Mask Aligner[3] |
| Equipped with | — | Wafer Thickness Measurement[3] |
| Alignment mode | — | Topside Alignment (TSA)[4] |
| Operation mode | — | Automatic or Manual Mode[4] |
| Cassette operation | — | Cassette to cassette operation[4] |
| Alignment system | — | AL3000 Automatic Alignment[4] |
| Pattern recognition software | — | Cognex 8100 Pattern Recognition Software[4] |
| Exposure modes | — | Hard, Soft, Proximity, and Vacuum Contact Exposure Modes[4] |
| System power | — | 208/230V[4] |
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