Waferpedia

Comparison ledger

100versusNSR 2005 i 9 C i-Line

CEE 100, Nikon NSR 2005 i 9 C i-Line, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100CEE
OEMCEENikon
CategoryLithographyLithography
Wafer size6"Standard PDP 11/93 Computer & Silicon Carbide Wafer Loader Type 1 Conversion on it
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 100Nikon NSR 2005
Cited variants—
Specifications
Tool typeSpray Developer[1]—
Accepts wafer sizeup to 6" wafers[2]—
Programmable programs10 programs[2]—
Steps per programup to 10 steps[2]—
Programmable step parametersAcceleration, Speed, Time[2]—
Associated documentCEE Model 100CB Spinner.doc[2]—
Wafer sizeUp to 6 inches[2]Standard PDP 11/93 Computer & Silicon Carbide Wafer Loader Type 1 Conversion on it[3]
Programs10 programs each with up to 10 steps[2]—
Control parametersAcceleration, Speed, Time[2]—
Configuration—HDD & Software included[3]
Reticle—6", normal thickness[5]
Wafer—8", OF direction 0*, Ring type wafer[5]
Lens type—5iB3[5]
Magnification—1/5[5]
Field size—21.2 x 25.2mm[5]
Lamp power—1750 KW[5]
Light source—Mercury lamp[5]
Reticle Alignment—i-line, CCD imagining[5]
Make—Nikon[3]
Model—NSR 2005 i 9 C[3]
Reticle Size—6 inch[3]
Numerical Aperture (NA)—0.57 (selectable <0.57 >0.57)[7]
Exposure Light—i-line[7]
Sigma—0.56 – 0.80[7]
Alignment Light—HeNe Laser, Halogen Lamp[7]
Alignment Method—CCD imaging + image processing[7]
Alignment Mode—LSA (HeNe laser) or FIA (halogen lamp)[7]
XY Stage Drive Method—Ball screw drive & two-axis interferometer[7]
XY Stage Stroke X—−115 mm to +150 mm[7]
XY Stage Stroke Y—−160 mm to +115 mm[7]
Auto Focus Method—Halogen lamp + AF line sensor[7]
Wafer Leveling—Two-axis ball screw drive[7]
Chamber Set Temperature—23 °C[7]
Camera Type—CCD[7]
Power Supply—208 V, 3 Phase[6]
CE Mark Certified—Yes[6]
Handler Type—Prealign II[6]
Power—208 V, 3 Phase[6]
Manuals Included—Partial[6]
# of Cassette / FOUP Loaders—Cassette Stage[6]
Robot Type—OEM[6]
End Effecter Type—OEM[6]
Handler Options—SiC Substrate[6]
System SW (OS) Version—Nikon Nest[6]
Supporting Equipment—STD OEM Items[6]
CDA—N2[6]
DIW—Chilled Water[6]
PC Model—Present (original PC type)[7]
Hard Disk—Original[7]
NEST Upgrade—Version: NEST-2[7]
Wafer Size (6 inch)—6 inch[6]
Wafer Size (8 inch)—8 inch[5]
Numerical Aperture—0.57 (range <0.57 >0.57 selectable)[7]
Sigma Range—0.56 – 0.80[7]
Wafer Alignment Methods—LSA (HeNe laser), FIA (halogen lamp)[7]
Chamber Temperature Set—23 °C[7]
Camera / Vision—CCD Type[7]
Computer (some units)—Standard PDP 11/93[3]
Wafer Loader (some units)—Silicon Carbide Wafer Loader Type 1 Conversion[3]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing
  7. [7]inventory listing