Waferpedia

Comparison ledger

017-0024-01 PrealignerversusDWL66

Brooks 017-0024-01 Prealigner, Heidelberg Instruments DWL66, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
DWL66Heidelberg Instruments
OEMBrooksHeidelberg Instruments
CategoryLithographyLithography
Wafer size—6"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBrooks 017-0024-01 PrealignerHeidelberg Instruments DWL66
Cited variants—
Specifications
Resolution—40 nm, 100 nm, 200 nm, 400 nm[2]
Minimum feature—0.5 µm[2]
Laser sources—244 nm, 363 nm, 413 nm, 442 nm[2]
Substrates—glass, silicon or any other flat materials[2]
Exposure—photoresist[2]
Image size—140 mm x 140 mm[2]
Substrate size—up to 200 mm by 200 mm[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org