Comparison ledger
Axcelis 200 ACU, Oxford Instruments Plasmalab 800 Plus RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 ACUAxcelis | Plasmalab 800 Plus RIEOxford Instruments |
|---|---|---|
| OEM | Axcelis | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Axcelis NV GSD 200 | Oxford Instruments Plasmalab 800 |
| Specifications | ||
| Configuration | Parts Machine[1] | LEP Tungsten[5] |
| Manufacturer | Axcelis[1] | — |
| Model | 200 ACU[1] | — |
| Tool type | Asher[1] | — |
| Wafer size | 200mm[3] | — |
| Serial number | AU6A356AH[3] | — |
| Computer system | M 200 PC, M 200[4] | — |
| Part number | SC 4572 A[4] | — |
| Volts | 208[4] | — |
| Amps | 30[4] | — |
| Equipment type | Asher[1] | — |
| Wafer configuration | 8 inch[2] | — |
| Type | — | Reactive Ion Etching (RIE) System[6] |
| Controller | — | PC controller[7] |
| Footprint design | — | All electronics and vacuum components located within the tool body to minimize footprint[7] |
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