Comparison ledger
ASML 2500 40, CEE 100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2500 40ASML | 100CEE |
|---|---|---|
| OEM | ASML | CEE |
| Category | Lithography | Lithography |
| Wafer size | Wafer table | 6" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASML 2500 40 | CEE 100 |
| Cited variants | — |
|
| Specifications | ||
| Parts System | missing board and power supplies[2] | — |
| Configuration | Main body is complete with:[2] | — |
| Wafer size | Wafer table[2] | Up to 6 inches[4] |
| Illumination type | i-line[3] | — |
| Resolution (node) | 0.70 µm[3] | — |
| Tool type | — | Spray Developer[1] |
| Accepts wafer size | — | up to 6" wafers[4] |
| Programmable programs | — | 10 programs[4] |
| Steps per program | — | up to 10 steps[4] |
| Programmable step parameters | — | Acceleration, Speed, Time[4] |
| Associated document | — | CEE Model 100CB Spinner.doc[4] |
| Programs | — | 10 programs each with up to 10 steps[4] |
| Control parameters | — | Acceleration, Speed, Time[4] |
Plan your fab
Building a Lithography process? Get a complete equipment list.
Open the fab equipment planner →