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0010-13622 RF Match forversusSigma

Applied Materials 0010-13622 RF Match for, SPTS Sigma, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
SigmaSPTS
OEMApplied MaterialsSPTS
CategoryDepositionDeposition
Wafer size—A 1KW lamp for wafer heating
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forSPTS Sigma
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[1]Beta System[2]
Model0010-13622[1]Sigma[2]
Product TypeRF Match for PVD (Physical Vapor Deposition)[1]—
FeatureHigh Efficiency HE RF Match-Bias[1]—
Phase—Power Box (415 VAC, 3 Phase)[2]
Station 1—Vacuum Cassette Handler (VCH)[2]
Station 2—Pre Heat Chambers[2]
Wafer size—A 1KW lamp for wafer heating[2]
Station 3—Aluminum Dep Chamber[2]
Make—SPTS / STS[2]
Type—PVD (Physical Vapor Deposition)[2]
System configuration—Beta System[2]
Power box—415 VAC, 3 Phase[2]
Process station 2—Pre Heat Chambers[2]
Wafer heating—A 1KW lamp for wafer heating[2]
Process station 3—Aluminum Dep Chamber[2]
Aluminum target—Al/0.5% Cu[2]
Process station 4—Ti/TiN Dep chamber[2]
Titanium target—Ti 4N5[2]
Process station 5—Soft Sputter Etch chamber[2]
Base pressure—7E-8 Torr[2]
Station 4 RF generator—Advanced energy RFX-600 13.56 MHz RF generator[2]
Station 5 RF generator—Advanced energy RFX-600 A 13.56 MHz RF generator[2]
Station 4—Ti/TiN Dep chamber[2]
Station 5—Soft Sputter Etch chamber[2]
Station 6—Vacuum Cassette Handler (VCH)[2]
Station 3 target—Aluminium target - Al/0.5% Cu[2]
Station 4 target—Titanium target - Ti 4N5[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing