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Comparison ledger

160 XPversusE 500 EHPI Ion Implant

Varian 160 XP, Varian E 500 EHPI Ion Implant, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
160 XPVarian
OEMVarianVarian
CategoryIon ImplantationIon Implantation
Wafer size——
Process node——
Introduced——
Production run—2000–
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyVarian 160 XPVarian E 500 EHPI Ion Implant
Cited variants—
Specifications
Configuration (160 XP Ion variant)150mm High Current IMP[1]—
Power—208 V,50/60 Hz, 3 Phase[2]
Configuration—CE Mark[2]
Connection—Top[2]
Source 1—IHC[2]
Extraction Electrode—EHP[2]
Bushing—EHP[2]
Wafer Size—6 inch[2]
CE Mark—Yes[2]
Vintage—2000[2]
Control Computer—Windows 7[2]
Software Version—V15.10.12[2]
Chuck system—ESC[2]
Computer—Win7[2]
Software—V15.10.12[2]
Source Turbo—Pfeiffer[2]
Analyzer Turbo—Pfeiffer[2]
Scanner Turbo—Pfeiffer[2]
LoadLock right—Cryo[2]
LoadLock left—Cryo[2]
Source/Terminal—Edwards Setup[2]
Differential Seal—Busch Scroll Fossa 15[2]
End station / Load Lock—Edwards Setup[2]
Cryo Comp—9700A[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing