Waferpedia

Comparison ledger

Formulaversus0332 F 9453 302 Diffusion

Tokyo Electron Formula, Varian 0332 F 9453 302 Diffusion, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
FormulaTokyo Electron
OEMTokyo ElectronVarian
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTokyo Electron FormulaVarian 0332 F 9453 302 Diffusion
Cited variants
  • 12-inch TEOS / HF / F2 configuration[1]
  • 12-inch DCS / NH3 / HF / F2 configuration[2]
  • DCS SiN configuration[3]
  • Formula TEOS / HF / F2[1]
  • Formula DCS / NH3 / HF / F2[2]
  • Formula DCS SiN[3]
—
Specifications
ConfigurationTEOS / HF / F2[1]—
Wafer size12 inch[2]—
Process chemistryTEOS / HF / F2[1]—
Vintage2002[2]—
Wafer Size12 inch (300 mm)[1]—
Process Chemistry (variant)TEOS / HF / F2[1]—
Vintage (listed unit)2002[1]—
Process capabilitiesTEOS, HF, F2, DCS, NH3, SiN[1]—
Asset Number—142841[4]
Last Confirm Date—October 14, 2025[5]

Plan your fab

Building a Thermal / Diffusion process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]Equipment inventory listing
  5. [5]fab-spares.comfab-spares.com