Comparison ledger
Tegal 900e, Tegal 981ACS, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 900eTegal | 981ACSTegal |
|---|---|---|
| OEM | Tegal | Tegal |
| Category | Etch | Etch |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 900e | Tegal 981ACS |
| Cited variants | — | |
| Specifications | ||
| Tool type | single wafer cassette-to-cassette etch system[1] | — |
| Process | non-critical plasma etch processes[1] | — |
| Wafer size | 3 in to 150 mm wafers[1] | — |
| Control system | Advanced Control System (ACS) field upgrades available for customers already invested in the Tegal 900e Series[1] | — |
| Wafer size (diameter) | — | 150 mm, 200 mm[2] |
| Wafer size (square) | — | 100 mm square, 6-inch square[2] |
| Reactor type | — | Wide-gap diode (scaled-up version of 901ACS)[2] |
| Applications | — | Non-critical photoresist removal, photoresist trimming, large-scale etching, planarization, backside etching, BioChip nanotechnology[2] |
| Footprint | — | Small; no external rack-mount electronics[2] |
| User interface | — | Intuitive touchscreen interface[2] |
| Maintenance | — | Long-lasting, low maintenance parts[2] |
| Wafer handling | — | Cassette to cassette (no manual handling)[2] |
| Temperature control | — | All electrodes precisely temperature controlled[2] |
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