Waferpedia

Comparison ledger

MWS 612versusMWS 612 DD Multi

Takatori MWS 612, Takatori MWS 612 DD Multi, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
MWS 612Takatori
OEMTakatoriTakatori
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTakatori MWS 612Takatori MWS 612
Cited variants
  • MWS 612 DD Multi[1]
—
Specifications
Maximum workpiece shapeφ150mm x 300mm[2]—
Equipment typeWire saw[3]—
CategoryDicing & Grinding[3]—
Described variantTakatori MWS 612 DD Multi is a wire saw for 6-inch wafers[1]—
Phase—3 Phase[4]
Voltage—400V[4]
Frequency—50 Hz[4]
Missing—mist collector/separator[5]
Wafer Size—6 inch[4]
Vintage—2013[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]waferpedia.comwaferpedia.com
  5. [5]inventory listing