Comparison ledger
SUSS MicroTec SB 6 E, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SB 6 ESUSS MicroTec | 10490West Bond |
|---|---|---|
| OEM | SUSS MicroTec | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec SB 6 E | West Bond 10490 |
| Cited variants |
| — |
| Specifications | ||
| Wafer size | 150 mm o/ to 10 mm x 10 mm[1] | — |
| Stack thickness | up to 6 mm[1] | — |
| Post-bond alignment accuracy | down to 3 μm (down to 1 μm with laser prebond option in BA8/6)[1] | — |
| Bond force (thermo-compression tool) | up to 20 kN[1] | — |
| Chamber pressure range | vacuum to 3 bar (pressurized ambient)[1] | — |
| Temperature uniformity | < 1% at 550°C (on 200 mm wafer)[1] | — |
| Active cooling | Yes[1] | — |
| Software | Windows 2000-based graphical user interface with recipe editor[1] | — |
| Power requirements | 208 – 230 VAC, 50/60 Hz; 20A; 4200W[1] | — |
| Dimensions (L×D×H) | 1200 mm / 625 mm / 1400 mm[1] | — |
| Weight | 340 kg[1] | — |
| Operating system | Windows 2000[1] | — |
| Network interface | TCP/IP Ethernet 10/100 Base T or similar[1] | — |
| Vacuum requirement | 90-95 millibar @ 16.7 slpm, 8 mm OD tubing[1] | — |
| Compressed air requirement | CDA at 6-10 bar @ 16.7 slpm, filtered to < 40 micron, oil-free, 8 mm OD tubing[1] | — |
| Nitrogen requirement | 7-7.5 bar @ 8.4 slpm, filtered to < 40 micron, oil-free, 8 mm OD tubing[1] | — |
| Exhaust requirement | 10.6 cfm @ 0.21 millibar; 2" OD heat resistant connection (to 350°C)[1] | — |
| Cleanroom recommendation | Class 100 or better, 20-22°C, 40-45% RH, vibration isolation floor[1] | — |
| Manufacturer | — | West Bond[2] |
| Model | — | 10490[2] |
| Description | — | Convertible bonder, wedge to ball[3] |
| Tool type | — | Convertible bonder[4] |
| Bonding modes | — | Wedge bonding and ball bonding[4] |
| Use | — | Wire bonding[4] |
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