Waferpedia

Comparison ledger

150 e MaskversusMA 200 Gen 3 Mask

SUSS MicroTec 150 e Mask, SUSS MicroTec MA 200 Gen 3 Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
150 e MaskSUSS MicroTec
MA 200 Gen 3 MaskSUSS MicroTec
OEMSUSS MicroTecSUSS MicroTec
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySUSS MicroTec 150 e MaskSUSS MicroTec MA 200
Cited variants—
  • MA 200 Gen 3 (6")Gen 3[1]
  • MA 200 Gen 3 (8" Compact)Gen 3[2]
  • MA 200 Gen 3 (8" Complete PC)Gen 3[3]
Specifications
Phase—3 Phase + N + PE[1]
Configuration—25A[1]
Power—5.5kVA[1]
Voltage—400V~[1]
Maximum wafer size—up to 8" / 200 mm[4]
Wafer size (6" configuration)—6 inch[1]
Wafer size (8" configuration)—8 inch[2]
Operation type—Automatic[4]
Electrical supply (6" configuration)—3 Phase + N + PE - 25A - 5.5kVA - 50/60 Hz - 400V~[1]
Electrical supply (8" compact configuration)—3 Phase + N + PE - 50/60 Hz[2]
Hard disk and software (compact)—with HDD and Software[2]
Complete PC and HDD—Complete PC - HDD[3]
BSA option—BSA Option included[3]
DirectAlign option—DirectAlign Option included[3]
Equipment type—Mask Aligner[1]
Wafer sizes—6 inch[1]
Wafer size capability—up to 8"/200 mm[4]
Automation—Automatic mask aligner[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]web.archive.orgweb.archive.org