Comparison ledger
Shinkawa UTC 1000, Shinkawa UTC 5000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UTC 1000Shinkawa | UTC 5000Shinkawa |
|---|---|---|
| OEM | Shinkawa | Shinkawa |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2005 Vintage | — |
| Control system | — | — |
| Generation | — | — |
| Family | Shinkawa UTC | Shinkawa UTC |
| Specifications | ||
| Bonding Method | Ultrasonic Thermo Compression[1] | — |
| Machine Accuracy | +/- 2.5 µm (+/- 3.3 µm for multi-bonding setting)[1] | — |
| Bonding Speed | 67 ms / 2 mm Wire (With Loop Control)[1] | — |
| Bonding Wire Length | Max. 8 mm[1] | — |
| Number of Bonding Wires | 8000 Wires[1] | — |
| Loader / Unloader | Magazine Stacker Type[1] | — |
| Indexer | Center-Parting Type Universal Indexer[1] | — |
| Power Supply | AC 100 V +/- 5 % 50/60 Hz[1] | — |
| Power Consumption | Approx. 1000 W[1] | — |
| Compressed Air | 500 kPa {5 kgf / cm²} 60 I / min[1] | — |
| Vacuum pressure | -74 kPa (-550 mmHg) or less (Gauge Pressure)[1] | — |
| Dimensions & Mass | 1080 W x 950 D x 1940 H mm , Approx. 590 kg[1] | — |
| Configuration | Pattern Recognition Unit:[1] | Complete with HDD[3] |
| Detection Method | Gray Scale Correlation[1] | — |
| Detection Speed | 0.11 s Max,. / 2 Point Alignment (including move time)[1] | — |
| Lead Side | MAx. X: +/- 1.26 mm, Y: +/- 0.86 mm[1] | — |
| Die Side | Max. X: +/- 0.31 mm, Y: +/- 0.21 mm[1] | — |
| Bonding Area | X: +/- 28 mm, Y: +/- 33 mm[1] | — |
| Machine Accuracy (single bond) | ±2.5 µm[1] | — |
| Machine Accuracy (multi-bonding) | ±3.3 µm[1] | — |
| Max Bonding Wire Length | 8 mm[1] | — |
| Loader/Unloader Type | Magazine Stacker Type[1] | — |
| Indexer Type | Center-Parting Type Universal Indexer[1] | — |
| Dimensions (W x D x H) | 1080 x 950 x 1940 mm[1] | — |
| Mass | Approx. 590 kg[1] | — |
| Pattern Recognition Detection Method | Gray Scale Correlation[1] | — |
| Pattern Recognition Detection Speed | 0.11 s max for 2-point alignment (including move time)[1] | — |
| Detection Area (Lead Side) | Max X: ±1.26 mm, Y: ±0.86 mm[1] | — |
| Detection Area (Die Side) | Max X: ±0.31 mm, Y: ±0.21 mm[1] | — |
| Wire Diameter (Gold Wire) | Ø15–38 µm, 2-inch double flange spool[1] | — |
| Applicable Lead Frame Width | 20–80 mm[1] | — |
| Applicable Lead Frame Length | 95–262 mm[1] | — |
| Applicable Lead Frame Thickness | 0.07–0.3 mm[1] | — |
| Gold Wire | Ø 15 ~ 38 µm[1] | — |
| Width | 20 ~ 80 mm[1] | — |
| Length | 95 ~ 262 mm[1] | — |
| Wafer Size | — | 12 inch[3] |
| Vintage | — | 2019[3] |
| Type | — | Wire Bonder[4] |
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