Waferpedia

Comparison ledger

Momentum II 100versus1000FP

MPM Momentum II 100, YES 1000FP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMMPMYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyMPM Momentum II 100YES 1000FP
Specifications
ConfigurationAutomatic Stencil Positioning[1]—
Machine typeStencil printer[2]—
Automatic stencil positioning camera visionIncluded[2]—
Automatic stencil-to-board alignmentIncluded[2]—
Stencil cleanerUltraWipe stencil cleaner[2]—
Maximum board size609.6 mm x 508 mm (24" x 20")[3]—
Print speed0.635 mm/s - 304.8 mm/s[3]—
Accuracy and repeatabilityCpk ≥ 2.0[3]—
Wet print deposit±17 microns (±0.0007") at 6 sigma[3]—
Alignment repeatability±11 microns @ 6 sigma[3]—
Wet print accuracy20µm@6σ, Cpk ≥ 2[3]—
Line-length reduction200 mm shorter than the standard Momentum II stencil printer platform[3]—
System type—Plasma cleaning system[4]
Line—R-Series Plasma Cleaning Systems (Glen Technologies)[4]
Model—Glen/YES 1000FP[4]
Designed use—Designed to accept a range of shelf sizes[4]
Application focus—Changing needs of the flat panel industry[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]efsmt.comefsmt.com
  4. [4]web.archive.orgweb.archive.org