Waferpedia

Comparison ledger

12 LapperversusDSS 200 Series II Post

Lapmaster 12 Lapper, Ontrak DSS 200 Series II Post, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
OEMLapmasterOntrak
CategoryCMPCMP
Wafer size——
Process node——
Introduced—2023
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Ontrak DSS 200
Specifications
Outside plate diameter12 inches[1]—
Lapping Speed Range0 to 60 rpm[2]—
Wafer Size Compatibility4 inches or smaller[1]—
Input Voltage110 V[1]—
Frequency60 Hz[1]—
Phase1[1]—
Number of Rings3[1]—
Number of Weights3[1]—
Includes Slurry SystemYes[1]—
Includes TimerYes[1]—
Voltage—200/ 208 / 220 VAC[3]
Configuration—50/60 Hz[3]
Breaker—25 A (5.2 kW)[3]
Total FLA—6.8 A (1.4 kW)[3]
Largest Load—3.6 A (0.8kW)[3]
CDA (Clean Dry Air)—80-100 PSI (Inlet)[3]
DI Water—60-80 PSI (Inlet)[3]
Process Solutions / Chems—15 PSI (Inlet)[3]
Drain—132 GpH Peak, 60 GpH Idle, 2" CPVC[3]
Noise Level—70 dB (during process)[3]
Total FL—6.8 A (1.4 kW)[4]
Largest load—3,6A (0,8kW)[5]
Process solutions/chems—15PSI (Inlet), 1/4" OD Teflon tubing[5]
Wafer Sizes—8 inch[3]
CDA (Clean Dry Air) Inlet—80-100 PSI, 3/8" OD Tubing[3]
DI Water Inlet—60-80 PSI, 3/4" OD Teflon Tubing[3]
Process Solutions / Chems Inlet—15 PSI, 1/4" OD Teflon Tubing[3]
Wafer Size—8 inch[3]
CDA Inlet Pressure—80-100 PSI[3]
CDA Tubing—3/8" OD[3]
DI Water Inlet Pressure—60-80 PSI[3]
DI Water Tubing—3/4" OD Teflon[3]
Process Solutions / Chems Pressure—15 PSI[3]
Process Solutions / Chems Tubing—1/4" OD Teflon[3]
Drain Flow (Peak)—132 GpH[3]
Drain Flow (Idle)—60 GpH[3]
Drain Pipe Size—2" CPVC[3]
Noise Level (during process)—70 dB[3]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]jmind.comjmind.com
  2. [2]etd.ohiolink.eduetd.ohiolink.edu
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing