Comparison ledger
KLA P-15, Zygo Z3D-7000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | P-15KLA | Z3D-7000Zygo |
|---|---|---|
| OEM | KLA | Zygo |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | 5th generation |
| Family | KLA P-15 | Zygo Z3D-7000 |
| Specifications | ||
| Sample table | 200 mm sample table with vacuum[1] | — |
| Measurement range | Measures steps from 100 Å to 300 µm[1] | — |
| Maximum sample thickness | 20 mm[1] | — |
| Minimum sample length | 25 mm[1] | — |
| Tool type | Profilometer[2] | — |
| Measurement capabilities | Measures roughness, waviness, step height, and other surface characteristics[3] | — |
| Wafer capability | Up to 8"/200mm wafer capable[3] | — |
| Control platform | Windows NT[3] | — |
| Software version | Profiler v6.41[3] | — |
| Automation | Computer controlled; automatic measurement capability[3] | — |
| Measurement type | — | Non-contacting, non-destructive optical metrology[4] |
| Wafer sizes | — | 200 mm and 300 mm wafers[4] |
| Bridge-tool configuration | — | Can be configured to simultaneously handle both wafer sizes[4] |
| Key features | — | High speed non-contacting metrology; simultaneously measures multiple parameters; ISO Class 2, S2/S8, and CE certified; SEMI E95 compliant software; modular IntelliSensors reduce MTBR[4] |
| Technology | — | ZYGO's fifth generation interferometric technology[4] |
| Software | — | MetroPro software[4] |
| Loaded wafers | — | FOUPS and/or open cassettes[4] |
| Throughput | — | Exceeds throughput of contact technologies (profilers, atomic force microscopes) by a factor of 10[4] |
| Simultaneous measurements | — | Film thickness, critical dimensions, overlay, trench depth, and general surface topography[4] |
| Precision | — | Sub-nanometer precision for critical etch depth processes[4] |
| Wafer loading | — | FOUPS and/or open cassettes, pre-alignment, super flat chuck[4] |
| Certifications | — | ISO Class 2, S2/S8, CE certified[4] |
| Software compliance | — | SEMI E95 compliant[4] |
| Modular sensors | — | IntelliSensors reduce MTBR[4] |
| Algorithms | — | OneShot, TopSlice, FilmSlice[4] |
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