Comparison ledger
KLA 1007, Signatone WL-210, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1007KLA | WL-210Signatone |
|---|---|---|
| OEM | KLA | Signatone |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | up to 8-inch wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 1007 | Signatone WL-210 |
| Cited variants | — |
|
| Specifications | ||
| Manufacturer | KLA[2] | — |
| Model | 1007[2] | — |
| Description | Wafer Prober[2] | — |
| Wafer size | 150 mm[2] | — |
| Convertible to 8 inch wafer size | Yes[2] | — |
| Vintage | 01.06.1995[2] | — |
| Make | KLA[3] | — |
| Equipment type | Prober[3] | — |
| Base | — | Massive 2" one-piece machined aircraft aluminum base for stability[1] |
| Platen | — | Large heavy-duty nickel steel platen with 4 point planar lift[1] |
| Positioning stage | — | Fast, accurate and repeatable compound X-Y stage for sub-micron positioning[1] |
| Wafer/substrate compatibility | — | Accepts shards through 8" wafers, substrates, PCB's, and ultra-thin wafers[1] |
| Platen control | — | Independent platen height (locking) and contact / separate control[1] |
| Chuck and stage assembly | — | Non-ferrous chuck and stage assembly reduces magnetic interference and crosstalk[1] |
| Micropositioner support | — | Supports bolt-down, vacuum, and magnetic base micropositioners[1] |
| Chuck biasing | — | Banana / BNC / Triax chuck biasing[1] |
| Probe card holder | — | Quick-Change probe card holder option with independent theta adjust[1] |
| Microscope | — | Tilt-back microscope provides unobstructed fixturing access[1] |
| Type | — | RF / Microwave Probe Station[1] |
| Series | — | WaveLink Series[1] |
| Platen height control | — | Independent platen height (locking) and contact / separate control[1] |
| Microscope access | — | Tilt-back microscope provides unobstructed fixturing access[1] |
| Chuck XY stage travel range | — | 205 mm x 205 mm (8.07 x 8.07 in)[4] |
| Standard wafer chuck diameter | — | 203 mm[4] |
| Supported DUT sizes | — | 25mm, 75mm, 100mm, 150mm, 200mm[4] |
| RF applications | — | Up to 110GHz[4] |
| mmW range | — | 110GHz -1.5THz[4] |
| High power application | — | Up to 12KV /600A[4] |
| Temperature capability | — | Ambient, +300°C[4] |
| Quick-change probe card holder | — | Quick-Change probe card holder option with independent theta adjust[1] |
Plan your fab
Building a Test & Probe process? Get a complete equipment list.
Open the fab equipment planner →