Comparison ledger
EV Group 510 Wafer, EV Group 520, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 510 WaferEV Group | 520EV Group |
|---|---|---|
| OEM | EV Group | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Manual wafer load substrate bonder | Manual wafer load substrate bonder |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 510 | EV Group 520 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Refurbished[2] | Refurbished[5] |
| Wafer size | Manual wafer load substrate bonder[2] | Manual wafer load substrate bonder[5] |
| Max Bond Force | 10 kN[2] | 7 kN[5] |
| Top side heater | 550°C max. in 1°C steps[2] | — |
| Bottom side heater | 550°C max. in 1°C steps[2] | — |
| Temperature uniformity | ± 1,5 % Turbo pump and controller[2] | ± 1,5 %[5] |
| Manufacturer | EV Group[2] | — |
| Model | 510 Wafer[2] | 520[5] |
| Category | Packaging & Bonding[3] | — |
| Wafer handling | Manual wafer load substrate bonder[3] | — |
| Bonding capability | Fusion and thermal compression bonding[2] | — |
| Bond chamber | High-vacuum capable bond chamber[3] | High-vacuum capable bond chamber[5] |
| Control software | Windows based control software and operation interface[2] | Windows based control software and operation interface[5] |
| Turbo pump and controller | Included[2] | — |
| Roughing pump | Included[2] | — |
| System chiller | Included[2] | — |
| Load/unload tool | Included[2] | — |
| System computer, monitor, and keyboard | Included[2] | — |
| Vacuum | Standard: 0.1 mbar; optional: 1E-5 mbar[4] | — |
| Max temperature | 550 °C[4] | — |
| Loading chamber | Manual[4] | — |
| Max contact force | 10, 20, 60 kN[4] | — |
| Heater size | 150 mm, 200 mm[4] | — |
| Single chips processing | Yes[4] | — |
| Active water cooling | For bottom side[4] | — |
| Power supply for anodic bonding | Max voltage 2 kV; max current 50 mA[4] | — |
| Phase | — | 3 Phase[5] |
| Wafer Size | — | up to 150 mm capable[5] |
| Vacuum Chuck | — | 6"/150mm diameter chuck[5] |
| Top Side Heater | — | 550°C max. in 1°C steps[5] |
| Bottom Side Heater | — | 550°C max. in 1°C steps[5] |
| OEM | — | EV Group[5] |
| Load type | — | Manual wafer load substrate bonder[5] |
| Wafer size (as configured) | — | 6 inch[5] |
| Wafer size capability | — | up to 150 mm capable[5] |
| Max bond force (configured system) | — | 7 kN[5] |
| Top side heater max temperature | — | 550°C max. in 1°C steps[5] |
| Bottom side heater max temperature | — | 550°C max. in 1°C steps[5] |
| Power requirements | — | 50 / 60 Hz - 120 / 208 V - 3 Phase[5] |
| Bonding capability (configured system) | — | Fusion & thermal compression bonding; anodic bonding[5] |
| Bond tool cover | — | Auto opening of bond tool cover[5] |
| Chiller | — | Thermoflex 1400 Chiller (or equivalent)[5] |
| Pumping | — | Turbo pump and controller; roughing pump[5] |
| System configuration (EVG520 IS) | — | Single or dual chamber wafer bonding system[1] |
| Automation (EVG520 IS) | — | Fully automated processing with manual loading and unloading including external cooling station[1] |
| Aligner compatibility (EVG520 IS) | — | Compatible with EVG mechanical and optical aligners[1] |
| Chambers (EVG520 IS) | — | Single- or double-chamber automated system[1] |
| Cooling (EVG520 IS) | — | Integrated cooling station for high throughput; active water cooling top and bottom; integrated cooling optional[1] |
| Max contact force (EVG520 IS) | — | 10, 20, 60, 100 kN[1] |
| Heater size (EVG520 IS) | — | 150 mm, 200 mm[1] |
| Minimum substrate dimension (EVG520 IS) | — | single chips 100 mm[1] |
| Vacuum standard (EVG520 IS) | — | 1E-5 mbar[1] |
| Vacuum optional (EVG520 IS) | — | 1E-6 mbar[1] |
| Max temperature (EVG520 IS) | — | Standard: 550 °C; Optional: 650 °C[1] |
| Single chips processing (EVG520 IS) | — | Yes[1] |
| Loading chamber (EVG520 IS) | — | Manual[1] |
| Max bond chambers (EVG520 IS) | — | 2[1] |
| Anodic bonding power supply (EVG520 IS) | — | Max. voltage: 2 kV; max. current: 50 mA[1] |
| Chuck / alignment systems (EVG520 IS) | — | 150 mm heater: EVG 610, EVG 620, EVG 6200; 200 mm heater: EVG 6200, SmartView NT[1] |
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