Waferpedia

Comparison ledger

120 Automated Coater ProcessingversusFalcon

EV Group 120 Automated Coater Processing, SUSS MicroTec Falcon, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
FalconSUSS MicroTec
OEMEV GroupSUSS MicroTec
CategoryResist ProcessingResist Processing
Wafer size—Wafer Backside Rinse
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 120 Automated Coater ProcessingSUSS MicroTec Falcon
Specifications
Configuration50/60 Hz[1]Polyimid[2]
Phase3 Phase[1]—
Wafer sizes6 inch, 8 inch[1]—
Frequency50/60 Hz[1]—
Wiring configuration4 Wire + GND[1]—
Vintage2015[1]—
Cassette Elevators—2[2]
Developer Dispensers—2[2]
Wafer size—Wafer Backside Rinse[2]
Number of Hot Plates—0[2]
Number of Chill Plates—0[2]
Controller Type—Microprocessor Controller[2]
Power Requirements—380 V, 50/60 Hz, 3 Phase[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing