Comparison ledger
EV Group 101, SUSS MicroTec MA 200 Gen 3 Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | MA 200 Gen 3 MaskSUSS MicroTec |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | SUSS MicroTec MA 200 |
| Cited variants | — | |
| Specifications | ||
| OEM | EV Group[4] | — |
| Model | 101[4] | — |
| Equipment name | EVG 101 Spray Coater[4] | — |
| NEMO ID | evgspraycoat[4] | — |
| Training required | EVG 101 Training[4] | — |
| Training duration | 1.50 hours[4] | — |
| Processing technique | Resist Spray Coat (manual)[4] | — |
| Cleanliness | "All"[4] | — |
| Location | SNF Paul G Allen L107 Cleanroom[4] | — |
| Wafer diameter (substrate size) | up to 300 mm[5] | — |
| Available modules | Spin coat / OmniSpray® / develop[5] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[5] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[5] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[6] | — |
| Cleanliness group (at SNF) | "All"[4] | — |
| Phase | — | 3 Phase + N + PE[1] |
| Configuration | — | 25A[1] |
| Power | — | 5.5kVA[1] |
| Voltage | — | 400V~[1] |
| Maximum wafer size | — | up to 8" / 200 mm[7] |
| Wafer size (6" configuration) | — | 6 inch[1] |
| Wafer size (8" configuration) | — | 8 inch[2] |
| Operation type | — | Automatic[7] |
| Electrical supply (6" configuration) | — | 3 Phase + N + PE - 25A - 5.5kVA - 50/60 Hz - 400V~[1] |
| Electrical supply (8" compact configuration) | — | 3 Phase + N + PE - 50/60 Hz[2] |
| Hard disk and software (compact) | — | with HDD and Software[2] |
| Complete PC and HDD | — | Complete PC - HDD[3] |
| BSA option | — | BSA Option included[3] |
| DirectAlign option | — | DirectAlign Option included[3] |
| Equipment type | — | Mask Aligner[1] |
| Wafer sizes | — | 6 inch[1] |
| Wafer size capability | — | up to 8"/200 mm[7] |
| Automation | — | Automatic mask aligner[7] |
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