Comparison ledger
Esec Datacon 2200 evo hF, MRSI 505 Die Attach, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 505 Die AttachMRSI | |
|---|---|---|
| OEM | Esec | MRSI |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 4" | 4" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | 3rd generation | — |
| Family | Esec Datacon 2200 evo hF | MRSI 505 Die Attach |
| Cited variants | — | |
| Specifications | ||
| Machine type | Die Bonder[1] | — |
| Platform generation | 3rd generation[1] | — |
| Platform description | most flexible 300 mm high speed platform[1] | — |
| Bonding method | Epoxy[1] | — |
| Cycle time | 120 ms with Liquid Cooling option[1] | — |
| Bonding accuracy | 20 µm @ 3σ (15 µm option)[1] | — |
| Wafer size | 4" to 12" (on 8" or 12" wafer frames)[1] | — |
| Die size | 0.25 mm (with Small Die Kit) to 20 mm[1] | — |
| Leadframe size | Length: 90 to 300 mm; Width: 23 to 100 mm[1] | — |
| Machine dimensions | 1785 x 1448 x 1400 mm (W x D x H)[1] | — |
| Product type | Automatic die bonder[2] | — |
| Bond force | 0.5 to 500 N[3] | — |
| X/Y placement accuracy | ±10 µm @ 3s[3] | — |
| Theta placement accuracy | ±0.15° @ 3s[3] | — |
| Wafer handling | SEMI-conform 12" wafer handling[3] | — |
| Substrate working range | 12" x 7" (300 mm x 175 mm)[3] | — |
| Die thickness | 0.17 mm to 7 mm[3] | — |
| Overall dimensions | 1160 x 1225 x 1800 mm[2] | — |
| Footprint LxDxH | 1160 mm x 1225 mm x 1800 mm[3] | — |
| Chip trays | Waffle pack/Gel-Pak 2" x 2" and 4" x 4", JEDEC tray on request[3] | — |
| Heated bond head | 450 °C[3] | — |
| Standard bond head rotation | 0° to 360°[3] | — |
| Substrate heating | 350 °C (optional)[3] | — |
| Uptime | > 98%[3] | — |
| Yield | > 99.95%[3] | — |
| Wafer Size | — | 4", Also used on Substrate 3x5" and Chip on Tape[4] |
| Configuration | — | Comes with Standard Boats / Cassettes[4] |
| Also used on Substrate | — | 3x5" and Chip on Tape[4] |
| Comes with Standard Boats / Cassettes | — | Yes[4] |
| Vintage (listed unit) | — | 2001[5] |
| Description | — | Die Attach/ Multichip Module[5] |
| Version | — | assembly[5] |
| Manufacturer | — | MRSI[6] |
| Model | — | 505[6] |
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