Comparison ledger
Electroglas 1034, Hesse & Knipps Bondjet BJ 855, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1034Electroglas | Bondjet BJ 855Hesse & Knipps |
|---|---|---|
| OEM | Electroglas | Hesse & Knipps |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Electroglas 1034 | Hesse & Knipps Bondjet BJ 855 |
| Specifications | ||
| Equipment type | — | High speed fully automatic fine wire bonder (wedge-wedge and ball-wedge)[1] |
| Working area X | — | 305 mm (12 in)[1] |
| Working area Y | — | 410 mm (16 in)[1] |
| Working area Z | — | 19 mm[1] |
| Z stroke | — | 32 mm[2] |
| P rotation | — | 440°[2] |
| Bonding speed | — | Up to 7 wires per second (application dependent)[1] |
| Wire diameter (Al, Au, Ag, Pt) | — | 12.5 µm – 75 µm (0.5 mil – 3 mil)[1] |
| Wire diameter (Cu) | — | 12.5 µm – 50 µm (0.5 mil – 2 mil)[1] |
| Wire materials | — | Al, Au, Ag, Cu, Pt, Ni[3] |
| Ribbon dimensions | — | Al, Au: 35 µm x 6 µm up to 250 µm x 25 µm (1.4 mil x 0.25 mil up to 10 mil x 1 mil)[1] |
| Fine pitch (wedge-wedge) | — | 40 µm inline, 25 µm staggered/dual line (depending on wire diameter and loop)[1] |
| Bondhead options | — | Wedge-wedge bondhead 45°, 60°, 90° (deep access for ribbon or wire); ball-wedge bondhead[2] |
| Ultrasonic frequency | — | 100 kHz (alternative frequencies available on request)[3] |
| Footprint (W x D x H) | — | 740 mm x 1484 mm x 1912 mm[1] |
| Weight | — | approx. 1150 kg[1] |
| Power supply | — | 230 V AC, 16 A[2] |
| Media connectivity | — | Compressed air (clean, dry air / high purity), vacuum[1] |
| Interfaces | — | Gigabit Ethernet (TCP/IP), USB ports, HDMI, SMEMA connection, Profibus support[2] |
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