Comparison ledger
Disco 321, Disco DGP 8761 DFM 2800 Back, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 2 Independent loadports, 25 wafer front opening unified pod (FOUP) carrier |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Disco DGP 8761 |
| Specifications | ||
| OEM | Disco[1] | Disco[4] |
| Model | 321[1] | DGP 8761 / DFM 2800[4] |
| Equipment type | Wafer Dicing Saw[1] | Back Grinder[4] |
| Facility context | Cleanroom Instrumentation[1] | — |
| Application area | Nano and Micro Fabrication[1] | — |
| Location | FNT 4.106[1] | — |
| Wafer Size | Up to 6 inches[2] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3] | — |
| Spindle Power (alternate) | 1500 Watt spindle[2] | — |
| Non-Contact Setup | Non Contact Setup[3] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3] | — |
| Broken Blade Detection | Broken Blade Detection[3] | — |
| Light Tower | Includes Light Tower[3] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[2] | — |
| Wafer size capability | Up to 6" wafers[3] | — |
| Chuck | 6-inch porous film frame chuck[2] | — |
| Spindle power | 1500-watt spindle[2] | — |
| Footprint | Small footprint[2] | — |
| Setup | Non-contact setup[3] | — |
| Blade break detection | Broken blade detection[3] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[3] | — |
| Voltage | — | 200 VAC[4] |
| Phase | — | 3 Phase[4] |
| Full Load Current | — | 72 A[4] |
| Wafer size | — | 2 Independent loadports, 25 wafer front opening unified pod (FOUP) carrier[5] |
| Configuration | — | Pedestal style with vacuum[5] |
| Loadports | — | 2 independent loadports[5] |
| Carrier | — | 25 wafer front opening unified pod (FOUP) carrier[5] |
| Wafer handling robot | — | Wafer handling robot[5] |
| Wafer alignment system | — | Wafer alignment system with capability for notch detection and precise alignment[5] |
| Vacuum style | — | Pedestal style with vacuum[5] |
| Wafer ID reader | — | Included[5] |
| Chuck cleaning system | — | Included[5] |
| Porous vacuum chucks | — | 4[5] |
| Independent transfer arms | — | 2[5] |
| Wet grind spindles | — | 2 independent wet grind spindles[5] |
| Dry polish spindle | — | Included[5] |
| Grind wheels | — | 2[5] |
| Polishing wheel | — | Included[5] |
| Spin-dry station | — | Included[5] |
| Tape-side wash | — | For clean post grind[5] |
| Power | — | 200 VAC, 3 Phase[4] |
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