Waferpedia

Comparison ledger

200CBXversusWS-65

CEE 200CBX, Laurell WS-65, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
WS-65Laurell
OEMCEELaurell
Categoryspin coaterspin coater
Wafer size200mm—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control systemWindows—
Generation——
FamilyCEE 200CBXLaurell WS-65
Specifications
OEMBrewer Science[1]—
ModelCEE 200CBX[2]—
System typeprecision coat-bake system[2]—
Descriptiontrack-quality precision spin coater with a high-uniformity bake plate[2]—
Control interfaceWindows-based PC graphical user interface (GUI)[2]—
Substrate sizeup to 200mm round or 7 in. square[2]—
Maximum spin speedup to 6000 rpm[2]—
Dispense methodhand dispensed using pipettes[2]—
Usage descriptionphotoresist spinner[2]—
Spin speedup to 6000 rpm[2]—
Coating methodhand dispensed using pipettes[2]—
Bake platehigh-uniformity bake plate[2]—
Programmabilityprograms easily entered, monitored and stored[2]—
Typeprecision coat-bake system[2]—
Equipment type—Spin coater[3]

Plan your fab

Building a spin coater process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]udnf.udel.eduudnf.udel.edu
  2. [2]cores.research.asu.educores.research.asu.edu
  3. [3]aggiefab.tamu.eduaggiefab.tamu.edu