Comparison ledger
Branson 101-149-053 Gold Booster, SUSS MicroTec FC 250, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | FC 250SUSS MicroTec |
|---|---|---|
| OEM | Branson | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | SUSS MicroTec FC 250 |
| Specifications | ||
| Configuration | 1:1.5[1] | With a Julabo FLW1703 Chiller[4] |
| Manufacturer | Branson[2] | — |
| Model | 101-149-053[2] | — |
| Type | Gold Booster[2] | — |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| Maximum chip/substrate temperature | — | 450°C[5] |
| Bonding force range | — | 10 gf to 200 kgf[5] |
| Alignment accuracy (X/Y) | — | 1 µm at 3σ[5] |
| Optical magnification | — | 400X[5] |
| Objective numerical aperture | — | 0.3[5] |
| Heating rate | — | 30 °C/s to 100 °C/s[5] |
| Stage resolution | — | 0.1 µm[5] |
| Minimum device size | — | 250 µm × 300 µm[5] |
| Granite plate flatness | — | 2 µm[5] |
| Stage size | — | 2 × 2 inches[4] |
| Tool type | — | die bonder[6] |
| Application | — | high-accuracy automated packaging of optoelectronic devices[5] |
| Alignment accuracy | — | 1 µm at 3σ[5] |
| Maximum temperature | — | 450°C[5] |
| Chiller | — | Julabo FLW1703[4] |
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