Waferpedia

Comparison ledger

22 AD 42versusDFD 6362

Blanchard 22 AD 42, Disco DFD 6362, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
22 AD 42Blanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 22 AD 42Disco DFD 6362
Specifications
Phase3 Phase[1]—
Frequency60 Hz[1]—
Voltage120 Vac[1]—
ConfigurationNo coolant tank[1]—
Max workpiece size—Φ300 mm[2]
X-axis cutting range—310 mm[2]
Cutting speed—0.1 – 1000 mm/s[2]
Y1/Y2 cutting range—310 mm[2]
Index step—0.0001 mm[2]
Positioning accuracy (X axis)—Within 0.002 mm / 310 mm (Single error)[2]
Z-axis max stroke—14.7 mm (for Φ2 inch blade); 14.9 mm (for Φ3 inch blade)[2]
θ-axis max rotating angle—380 deg[2]
Spindle rated torque (1.2 kW / high-speed rotation)—0.19 N·m[2]
Spindle rotation speed range (1.2 kW / 1.8 kW)—6,000 – 60,000 min⁻¹[2]
Spindle rotation speed range (high-speed rotation)—20,000 – 80,000 min⁻¹[2]
Equipment dimensions (W×D×H)—1,200 × 1,550 × 1,800 mm[2]
Equipment weight—Approx. 2,050 kg[2]
Power supply phase—3 Phase[3]
Power frequency—50/60 Hz[3]
Voltage range—308 – 415 VAC ±10%, 3 Phase[3]
Full load current—9 A[3]
Machine main breaker rating—20 A[3]
Standard spindle power—1.2 kW[4]
Optional spindle powers—1.8 kW or 2.2 kW[4]
Wafer size—300 mm[4]
Vintage—2010[4]
Serial number—NL1049[4]
Cassette type—Dual-stack cassette handler for 300 mm[4]
BCR system—Yes[4]
Touch screen display—Yes[4]
Automatic wheel covers—Yes[4]
Air ionizer—Yes[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]disco.com.sgdisco.com.sg
  3. [3]waferpedia.comwaferpedia.com
  4. [4]agsemiconductor.comagsemiconductor.com