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20 36 SurfaceversusDFL 7361

Blanchard 20 36 Surface, Disco DFL 7361, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
DFL 7361Disco
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—Integrated Wafer Cleaning System with Atomizing Nozzle
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco DFL
Cited variants—
  • SECS/GEM Software[1]
  • Intemal lighting[1]
  • Virus-free PC[1]
  • STM DFL7161 2021 SW unified[1]
  • Barcode reading function for auto recipe loading[1]
  • Compatibility with Hogomax 5L tanks[1]
  • Change of Laser Focus Position for Maintenance[1]
  • Additional Kerf check sequence[1]
  • Password Modification up to Level 4[1]
  • Disco CO2 Injector + Integration specs[1]
  • CO2 injector (stand-alone) added[1]
  • Addition of drain valve for CO 2 injector specific resistance value stabilization[1]
  • CO2 water target resistivity value Settable in device data[1]
  • CO2 bubbler support (RS232C)[1]
  • New version Zxis assembly for DFL7161 with higher rigidity specs (standard for STM)[1]
  • DFL7360[2]
  • DFL7360FH[2]
  • DFL7341[2]
  • DFL7340[2]
  • DFL7161[1]
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[3]Type FX Laser Head[1]
Magnetic Chuck ControlElectro-Matic Neutrol II[3]—
Wafer size—Integrated Wafer Cleaning System with Atomizing Nozzle[1]
Max workpiece size—ø300 mm[2]
Processing mode—Fully automatic[2]
X-axis feed speed range—0.1 - 1,000 mm/s[2]
Y-axis positioning accuracy—0.003 mm within 310 mm[2]
Dimensions (W x D x H)—1,210 x 3,270 x 1,906 mm[2]
Weight—approx 2,570 kg[2]
Supported wafer size—2" to 12"[1]
Laser head—Type FX[1]
Optics system—BSS-6[1]
Wafer cleaning system—Integrated with Atomizing Nozzle[1]
OEM—Disco[1]
Model—DFL 7361[1]
Category—Laser Saw[1]
Maximum workpiece size—ø300 mm[2]
Processing method—Fully automatic[2]
Dimensions (WxDxH)—1,210 x 3,270 x 1,906 mm[2]
Chuck table—Chuck Table moving in X- and Y-direction; 12" and 8" Porous Chuck Table & Spinner Table[1]
User interface—Graphical User Interface with Touch Screen[1]
Vision system—High Resolution Image Processing System with Auto Focus[1]
Frame handling—Fully Automatic Frame Handling System[1]
Coating system—Independent Hogomax spin coating system[1]
Loading/unloading—Cassette Loading / Unloading[1]
Duct unit—Duct Unit (Internal Type)[1]
Power conditioning—Overseas Transformer Unit; Uninterruptible Power Supply[1]
Documentation—Operation & Troubleshooting Manual (English); Installation and 3-days Operation Training[1]
Ablation processing support—Supports ablation processing; corresponding to 300mm workpiece[2]
Laser Head Type—Type FX[1]
Chuck Table Movement—X and Y direction[1]
Image Processing—High Resolution Image Processing System with Auto Focus[1]
Spin Coating System—Independent Hogomax spin coating system[1]
Chuck Table Sizes—12" and 8" Porous Chuck Table & Spinner Table[1]
Cassette Handling—Cassette Loading / Unloading[1]
Duct Unit—Internal Type[1]
Transformer—Overseas Transformer Unit[1]
Power Supply—Uninterruptible Power Supply[1]
X-Axis Feed Speed—0.1 - 1,000 mm/s[2]
Y-Axis Positioning Accuracy—0.003 mm or less per 310 mm[2]
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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]inventory listing