Waferpedia

Comparison ledger

18 D SurfaceversusDFD 651 Fully Automatic Dicing

Blanchard 18 D Surface, Disco DFD 651 Fully Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DFD 651 Fully Automatic Dicing
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[1]—
Model18 D[1]—
Asset #153970[1]—
Power416 V, 3 phase[1]—
Fully Automatic Dicing Saw—Yes[3]
Dual 1000W Synchro Spindle—Dual 1000W synchro spindle[3]
Macro/Micro Automatic Alignment—Yes[3]
High Pressure Spinner Cleaning Unit—Yes[3]
Non Contact Setup—Yes[3]
Broken Blade Detector—Yes[3]
Motorized 360° Theta—Yes[3]
Monitor with Camera—12-inch monitor with camera[3]
Chuck Table—8-inch universal chuck table[3]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]gtsaz.comgtsaz.com