Comparison ledger
Blanchard 18 D Surface, Disco DAD321, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 18 D SurfaceBlanchard | DAD321Disco |
|---|---|---|
| OEM | Blanchard | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 18 D Surface | Disco DAD321 |
| Specifications | ||
| Voltage | 416 V[1] | — |
| Phase | 3 Phase[1] | — |
| Cycles | 50[1] | — |
| Control Voltage | 110[1] | — |
| Make | Blanchard[1] | — |
| Model | 18 D[1] | — |
| Asset # | 153970[1] | — |
| Power | 416 V, 3 phase[1] | — |
| Machine type | — | Automatic dicing saw[3] |
| Wafer size | — | 100 mm, 150 mm[3] |
| Supported wafer materials | — | Silicon, glass and pyrex wafers[3] |
| Other materials | — | Other materials on demand[3] |
| Maximum thickness on silicon | — | 1 mm[3] |
| Maximum thickness on glass and pyrex | — | 2.4 mm[3] |
| Max wafer size | — | 6 inches[4] |
| Wafer type | — | All shapes and sizes[4] |
| Max wafer thickness | — | 2 mm[4] |
| Max blade speed | — | 30,000 rpm[4] |
| Max feed speed | — | 2 mm/sec[4] |
| Tape thickness | — | 70 μm[4] |
| Max thickness (silicon) | — | 1 mm[3] |
| Max thickness (glass/pyrex) | — | 2.4 mm[3] |
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