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Comparison ledger

NV GSD 200 Ionversus160 XP

Axcelis NV GSD 200 Ion, Varian 160 XP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
160 XPVarian
OEMAxcelisVarian
CategoryIon ImplantationIon Implantation
Wafer size150mm—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Varian 160 XP
Cited variants—
Specifications
Phase3 Phase[2]—
Voltage208V, 710A[2]—
GasesB/As/Ar[2]—
Total energy200 KEV[2]—
Throughput210 pieces/hour[2]—
ConfigurationFeatures:[2]—
Wafer size6 inch[2]—
Power3 Phase, 208V, 710A[2]—
Process gasesB/As/Ar[2]—
SDS gas lines2 lines (ASH3 and PH3)[2]—
HP gas lines2 lines (BF3 and ARGON)[2]—
Cassette25 slots, 4 cassettes capacity[2]—
Source headELS source head[2]—
Control hardware2 SUN Workstations, VME 177 cell controller[2]—
Post acceleration high voltage80 KEV[2]—
DriveBelt type rotary drive[2]—
Implant angleVariable, 2-axis[2]—
Dose controllerReal-time patented dose controller[2]—
Dose range5E11~1E16 Ions/cm2[2]—
ArmStd Arm 150mm[2]—
Wafer holderStd 150mm[2]—
Beam energy5 KeV[2]—
Beam current50 mA[2]—
Electron showerP-Shower electron shower[2]—
CE markingCE marked[2]—
Beam Current50 mACE marked[2]—
Configuration (160 XP Ion variant)—150mm High Current IMP[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing